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 Fault Tolerant Differential CAN Transceiver
TLE 6252 G
Target Data
Features * Data transmission rate up to 125 kBaud * Very low current consumption in stand-by and sleep mode * Optimized EMI behavior due to limited and symmetric dynamic slopes of CANL and CANH signals * Switches to single-wire mode during bus line P-DSO-14-2 failure events * Supports one-wire transmission mode with ground offset voltages up to 1.5 V * Preventation from bus occupation in case of CAN controller failure * Fully-integrated receiver filters * Short-circuit detection to battery and ground in 12 V powered systems * Thermal protection * Bus line error protection against transients in automotive environment Type
w TLE 6252 G w New type
Ordering Code Q67006-A9337
Package P-DSO-14-2 (SMD)
Functional Description The CAN Transceiver works as the interface between the CAN protocol controller and the physical differential CAN bus. Figure 1 shows the principle configuration of a CAN network. The TLE 6252 is optimized for low-speed data transmission (up to 125 kBaud) in automotive and industrial applications. In normal operation mode a differential signal is transmitted/received. When bus wiring failures are detected the device automatically switches in single-wire mode to maintain communication. While no data is transferred, the power consumption can be minimized by multiple low power modes.
Semiconductor Group
1
1998-11-01
TLE 6252 G
Local Area 1
Local Area 2
Controller 1
Controller 2
RxD 1
TxD 1
RxD 2
TxD 2
Transceiver 1
Transceiver 2
Bus Line
AES02410
Figure 1
CAN Network Example
Semiconductor Group
2
1998-11-01
TLE 6252 G
Pin Configuration (top view) P-DSO-14-2
INH TxD RxD NERR NSTB ENT WAKE 1 2 3 4 5 6 7 14 13 12 11 10 9 8
V BAT
GND CANL CANH
V CC
RTL RTH
AEP02411
Figure 2
Semiconductor Group
3
1998-11-01
TLE 6252 G
Table 1 Pin No. 1 2 3 4 5 6 7
Pin Definitions and Functions Symbol INH TxD RxD NERR NSTB ENT WAKE Function Inhibit output; For controlling an external 5 V regulator Transmit data input; LOW: bus is dominant, HIGH: bus is recessive Receive data output; LOW: bus is dominant Error flag output; LOW: bus error Not stand-by input; Digital control signal for low power modes Enable transfer input; Digital control signal for low power modes Wake-up input; If level of VWAKE changes the device initials a wake-up from sleep mode by switching INH HIGH Termination resistor output; For CANH line, controlled by internal failure management Termination resistor output; For CANL line, controlled by internal failure and mode management Supply voltage; +5V Bus line H; HIGH: dominant state, external pull-down for termination Bus line L; LOW: dominant state, external pull-up for termination Ground Battery voltage; + 12 V
8 9
RTH RTL
10 11 12 13 14
VCC
CANH CANL GND
VBAT
Semiconductor Group
4
1998-11-01
TLE 6252 G
Functional Block Diagram
V CC
10 9
V BAT
14
RTL
L Termination
CANH
11
Driver Temperature Protection Failure Management 2 TxD
CANL
12
RTH
8
H Termination Filter Receiver Output Stage 3 RxD
Failure Detect Wake - Up Time - Out
4
NERR
NSTB ENT
5 6 Stand - By Sleep Wake - Up Contol Unit
1 INH 7 WAKE 13 GND
AEB02412
Figure 3
Block Diagram
Semiconductor Group
5
1998-11-01
TLE 6252 G
General Operation Modes In addition to the normal operation mode, the CAN transceiver offers three multiple low power operation modes to save power when there is no bus achieved: sleep mode, VBat stand-by mode and VCC stand-by mode (see Table 2 and Figure 4). Via the control inputs NSTB and ENT the operation modes are selected by the CAN controller. In sleep operation mode the lowest power consumption is achieved. To deactivate the external voltage regulator for 5 V supply, the INH output is switched to high impedance in this mode. Also CANL is pulled-up to the battery voltage via the RTL output and the pull-up paths at input pins TxD and RxD are disabled from the internal supply. On a wake-up request either by bus line activities or by the input WAKE, the transceiver automatically switches on the voltage regulator (5 V supply). The WAKE input reacts to rising and falling edges. As soon as VCC is provided, the wake-up request can be read on both the NERR and RxD outputs, upon which the microcontroller can activate the normal operation mode by setting the control inputs NSTB and ENT high. In VCC-stand-by mode the wake up request is only reported at the RxD-output. The NERR output in this mode is set low when the supply voltage at pin Vbat was below the battery voltage threshold of 1 V. When entering the normal mode the Vbat-Flag is reseted and the NERR becomes high again. In addition the Vbat-Flag is set at a first connection of the device to battery voltage. This feature is usefull e.g. when changing the ECU and therefore a presetting routine of the microcontroller has to be started. If either of the supply voltage drop below the specified limits, the transceiver automatically goes to a stand-by mode.
Semiconductor Group
6
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TLE 6252 G
Table 2 0 0 0 1 0 0 1 0
Truth Table of the CAN Transceiver INH
1)
NSTB ENT Mode
NERR
RxD
RTL
VBAT stand-by
sleep mode 2) go to sleep command
Vbat
floating floating
active LOW wake-up interrupt if switched VCC is present to VBAT switched to VBAT switched to VBAT active LOW active LOW VBAT power-on wake-up interrupt flag active LOW error flag HIGH = receive; LOW = dominant receive data switched to VCC switched to VCC
VCC stand-by 3)
Vbat
1
1
normal mode
Vbat
1) 2) 3)
Wake-up interrupts are released when entering normal operation mode. If go to sleep command was used before. ENT may turn LOW as VCC drops, without affecting internal functions.
VBAT power-on flag will be reseted when entering normal operation mode.
Semiconductor Group
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TLE 6252 G
Normal Operation
NSTB 1 NSTB = 0 ENT = 0 V CC = 1 (NSTB = 0 ENT = 0) or V CC = 0 NSTB = 1 V CC = 1 INH HIGH NSTB = 0 or V CC = 0 NSTB = 1 ENT = 1 V CC = 1 ENT 1 INH HIGH
ENT = 1 V CC = 1
NSTB = 1 ENT = 1 V CC = 1
V CC Stand-By
NSTB 1 ENT 0
V BAT Stand-By
NSTB 0 ENT 0 INH HIGH
NSTB = 0 ENT = 1
NSTB = 1 ENT = 0 V CC = 1
ENT = 1 ENT = 0 t < th (Wake-Up from bus or via WAKE pin) V BAT t > t WO
Go to Sleep
NSTB = 1 V CC = 1 NSTB 0 ENT 1 INH float.
NSTB = 1 V CC = 1 ENT = 1 V CC = 1
Sleep Mode
ENT = 1 t > th NSTB 0 ENT 0 INH float.
AED02413
Figure 4
State Diagram
The transceiver will stay in a present operating mode until a suitable condition disposes a state change. If not otherwise defined all conditions are AND-combined. The signals VCC and VBAT show if the supply is available (e.g. VCC = 1 : VCC voltage is present). If at minimum one supply voltage is switched on, the start-up procedure begins (not figured). After a delay time the device changes to normal operating or stand-by mode.
Semiconductor Group 8 1998-11-01
TLE 6252 G
Bus Failure Management The TLE 6252 detects the bus failures as described in the following (Table 3, failures listed according to ISO 11519-2) and automatically switches to a dedicated CANH or CANL single wire mode to maintain data transmission if necessary. Therefore, it is equipped with one differential receiver and 4 single ended comparators, two for each bus line. To avoid false triggering by external RF influences the single wire modes are activated after a certain delay time. As soon as the bus failure disappears the transceiver switches back to differential mode after another time delay. Bus failures are indicated in the normal operation mode by setting the NERR output to LOW. To reduce EMI the dynamic slopes of the CANL and CANH signals are both limited and symmetric. This allows the use of an unshielded twisted or parallel pair of wires for the bus. During single-wire transmission the EMI performance of the system is degraded from the differential mode. The differential receiver threshold is set to - 2.8 V. This ensures correct reception in the normal operation mode as well as in the failure cases 1, 2 and 4 with a noise margin as high as possible. For these failures, further failure management is not necessary. Detection of the failure cases 1, 2 and 4 is only possible when the bus is dominant. Nevertheless, they are reported on the NERR output until transmission of the next CAN word on the bus begins. When one of the bus failures 3, 5, 6, 6a and 7 is detected, the defective bus wire is disabled by switching off the affected bus termination and the respective output stage. A wake-up from sleep mode via the bus is possible either via a dominant CANH or CANL line. This ensures that a wake-up is possible even if one of the failures 1 to 7 occurs. In case the transmission data input, TxD from the CAN controller is permanently dominant, both, the CANH and CANL transmitting stage, are deactivated after a delay time. This is necessary to prevent blocking the bus by a defective protocol unit. The transmit time out error is flagged on NERR.
Semiconductor Group
9
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TLE 6252 G
Table 3
Specified Wiring Failure Cases on the Bus Line (according to ISO 11519-2) CANH Wire Interrupted
1)
CANL
Failure case 2:
V CC
CANL
Failure case 1:
V CC
CANL
TxD 1 CANH
RxD 2
TxD 1 CANH
RxD 2
GND
AES02414
GND
AES02415
Wire Short-Circuited to GND
Failure case 4:
V CC
CANL
Failure case 5:
V CC
CANL
TxD 1 CANH GND GND
RxD 2
TxD 1 CANH GND
RxD 2
AES02416
GND
AES02417
Semiconductor Group
10
1998-11-01
TLE 6252 G
Table 3
Specified Wiring Failure Cases on the Bus Line (cont'd) 1) (according to ISO 11519-2) CANH Wire Short-Circuited to Battery CANL
Failure case 6: V CANH > 7.2 V Failure case 6a: 1.8 V < V CANH < 7.2 V (no ISO failure)
Failure case 3: V CANL > 7.2 V Failure case 3a: 1.8 V < V CANL < 7.2 V (no ISO failure)
V CC
CANL TxD 1 CANH RxD 2
TxD 1
V BAT
CANL
V CC
RxD 2 CANH
V BAT
GND
AES02418
GND
AES02419
CANL Mutually Short-Circuited to CANH
Failure case 7: CANL TxD 1 CANH RxD 2
V CC
GND
1)
AES02420
The images represent a communication between two participants of the network (see Figure 1). The controller of the local area 1 transmits data (TxD1) to the receiver of the local area 2 (RxD2). When a single failure of cases 1 to 7 occurs, the error handling enables communication through appreciated reactions.
Semiconductor Group
11
1998-11-01
TLE 6252 G
Circuit Protection A current limiting circuit protects the CAN transceiver output stages from damage by short-circuit to positive and negative battery voltages. The CANH and CANL pins are protected against electrical transients which may occur in the severe conditions of automotive environments. The transmitter output stage generates the majority of the power dissipation. Therefore it is disabled if the junction temperature exceeds the maximum value. This effectively reduces power dissipation, and hence will lead to a lower chip temperature, while other parts of the IC can remain operating. Absolute Maximum Ratings Parameter Input voltage at VBAT Logic supply voltage VCC Input voltage at TxD, RxD, NERR, NSTD and ENT Input voltage at CANH and CANL Input voltage at CANH and CANL Transient voltage at CANH and CANL Input voltage at WAKE Input current at WAKE Input voltage at INH, RTH and RTL Termination resistances at RTL and RTH Junction temperature Storage temperature Electrostatic discharge voltage at any pin
1) 2) 3) 4)
Symbol
Limit Values min. max. 40 6 - 0.3 - 0.3 - 0.3 - 10 - 40 - 150 - - 15 - 0.3 500 - 40 - 55 - 4000
Unit Notes V V V V V V V mA V C C V - - - -
1) 2)
VBAT VCC VIN VBUS VBUS VBUS VIN IIN VIN RRTL/H Tj Tstg Vesd
VCC + 0.3
27 40 100
VBAT + 0.3
-
-
3)
VBAT + 0.3
16000 150 155 4000
- - - -
4)
VCC = 0 to 5.5 V; VBAT > 0 V; t < 0.1 ms; load dump
See ISO 7637 Negative currents flowing out of the IC. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k resistor.
Note: Maximum ratings are absolute ratings; exceeding one of these values may cause irreversible damage to the integrated circuit.
Semiconductor Group 12 1998-11-01
TLE 6252 G
Operating Range Parameter Logic input voltage Battery input voltage Junction temperature Thermal Resistance Junction ambient Symbol Limit Values min. max. 5.25 27 150 V V C - - - 4.75 6 - 40 Unit Notes
VCC
VBAT
Tj
Rthja
-
120
K/W
-
Semiconductor Group
13
1998-11-01
TLE 6252 G
Static Characteristics 4.75 V VCC 5.25 V; VNSTB = VCC; 6 V VBAT 27 V; - 40 Tj + 125 C (unless otherwise specified). All voltages are defined with respect to ground. Positive current flowing into the IC. Parameter Symbol min. Supplies VCC, VBAT Supply current Limit Values typ. max. Unit Notes
ICC
-
3.5
10
mA
recessive; TxD = VCC; normal operating mode dominant; TxD = 0 V; no load; normal operating mode
-
6
20
mA
Supply current (VCC stand-by) Supply current (VBAT stand-by) Supply current (sleep operation mode)
ICC + IBAT IBAT + ICC IBAT
- - -
120 55 15
500 100 30
A A A
VCC = 5 V; VBAT = 12 V; TA < 90 C VCC = 0 V; VBAT = 12 V; TA < 90 C VCC stand-by mode VCC stand-by mode
Battery voltage for setting VBAT power-on flag Battery voltage low time for setting power-on flag
- -
- 200
1.0 -
V s
tpw(on)
Receiver Output RxD and Error Detection Output NERR HIGH level output voltage VOH (pin NERR) HIGH level output voltage VOH (pin RxD) LOW level output voltage VOL
VCC
- 0.9
- - -
VCC VCC
0.9
V V V
I0 = - 100 A I0 = - 250 A I0 = - 1.25 mA
VCC
- 0.9 0
Semiconductor Group
14
1998-11-01
TLE 6252 G
Static Characteristics (cont'd) 4.75 V VCC 5.25 V; VNSTB = VCC; 6 V VBAT 27 V; - 40 Tj + 125 C (unless otherwise specified). All voltages are defined with respect to ground. Positive current flowing into the IC. Parameter Symbol min. Limit Values typ. max. Unit Notes
Transmission Input TxD, Not Stand-By NSTB and Enable Transfer ENT HIGH level input voltage VIH threshold LOW level input voltage threshold HIGH level input current (pins NSTB and ENT) LOW level input current (pins NSTB and ENT) HIGH level input current (pin TxD) LOW level input current (pin TxD) 0.7 x - - 9 1 - 50 - 200 - 22
VCC
+ 0.3 0.3 x
V V A A A A V s
500 mV hysteresis 500 mV hysteresis
VCC
- 0.3 - 0 - 200 - 800 2.75 4
VIL IIH IIL IIH IIL
VCC
20 - - 25 - 100 4.5 38
Vi = 4 V Vi = 1 V Vi = 4 V Vi = 1 V
- -
VCC Forced battery voltage stand-by mode (fail safe)
Minimum hold time for Go-To-Sleep command Wake-up Input WAKE Input current Wake-up threshold voltage
thSLP
IIL VWK(th)
-3 2.0
-2 3.0
-1 4.0
A V
-
VNSTB = 0 V
Semiconductor Group
15
1998-11-01
TLE 6252 G
Static Characteristics (cont'd) 4.75 V VCC 5.25 V; VNSTB = VCC; 6 V VBAT 27 V; - 40 Tj + 125 C (unless otherwise specified). All voltages are defined with respect to ground. Positive current flowing into the IC. Parameter Symbol min. Inhibit Output INH HIGH level voltage drop VH = VBAT - VINH Leakage current VH - -5 0.5 - 0.8 5.0 V A Limit Values typ. max. Unit Notes
IINH = - 0.18 mA;
sleep operation mode; VINH = 0 V
ILI
Bus Lines CANL, CANH Differential receiver recessive-to-dominant threshold voltage Differential receiver dominant-to-recessive threshold voltage CANH recessive output voltage CANL recessive output voltage CANH dominant output voltage CANL dominant output voltage CANH output current
VdRxD(rd) - 2.8
- 2.5
- 2.2
V
VCC = 5.0 V
VdRxD(dr) - 3.17 - 2.87 - 2.58 V
VCC = 5.0 V
VCANHr VCANLr VCANHd
0.1
0.2 - -
0.3 -
V V V
TxD = VCC; RRTH < 4 k TxD = VCC; RRTL < 4 k TxD = 0 V; normal mode; ICANH = - 40 mA TxD = 0 V; normal mode; ICANL = 40 mA
VCC
- 0.2
VCC
- 1.4
VCC
VCANLd
-
1.1
1.4
V
ICANH
- 130 -
- 90 0
- 50 -
mA A
VCANH = 0 V;
TxD = 0 V sleep operation mode; VCANH = 12 V
Semiconductor Group
16
1998-11-01
TLE 6252 G
Static Characteristics (cont'd) 4.75 V VCC 5.25 V; VNSTB = VCC; 6 V VBAT 27 V; - 40 Tj + 125 C (unless otherwise specified). All voltages are defined with respect to ground. Positive current flowing into the IC. Parameter CANL output current Symbol min. Limit Values typ. 90 0 max. 130 - mA A - 50 - Unit Notes
ICANL
VCANL = 5 V;
TxD = 0 V sleep operation mode; VCANL = 0 V; VBAT = 12 V normal operation mode
Vdet(th) Voltage detection threshold for short-circuit to battery voltage on CANH and CANL Vdet(th) Voltage detection threshold for short-circuit to battery voltage on CANH
CANH wake-up voltage threshold CANL wake-up voltage threshold Wake-up voltage threshold difference CANH single-ended receiver threshold CANL single-ended receiver threshold CANH leakage current
6.5
7.3
8.0
V
VBAT
- 2.5
VBAT
-2
VBAT
-1
V
stand-by/ sleep operation mode - - VSLP = VSLPL -
VWAKEH VWAKEL
VWAKE
1.2 2.4 0.2 1.5 2.8 -
1.9 3.1 - 1.9 3.1 0
2.7 3.8 - 2.3 3.8 5
V V V V V A
VSLPH VCANH VCANL ICANHl
failure cases 3, 5 and 7 failure case 6 and 6a
VCC = 0 V, Vbat = 0 V, VCANL = 13.5 V, RRTL = 100 , Tj < 85 C
Semiconductor Group
17
1998-11-01
TLE 6252 G
Static Characteristics (cont'd) 4.75 V VCC 5.25 V; VNSTB = VCC; 6 V VBAT 27 V; - 40 Tj + 125 C (unless otherwise specified). All voltages are defined with respect to ground. Positive current flowing into the IC. Parameter CANL leakage current Symbol min. Limit Values typ. 0 max. 5 A - Unit Notes
ICANLl
VCC = 0 V, Vbat = 0 V, VCANH = 5 V, RRTH = 100 , Tj < 85 C
Termination Outputs RTL, RTH RTL to VCC switch-on resistance RTL output voltage
RRTL
-
43
95
Io = - 10 mA;
normal operating mode
VoRTL
VCC
- 1.0 10
VCC
- 0.7 16
- 35
V k
|Io| < 1 mA; VCC stand-by mode
RTL to BAT switch series RoRTL resistance RTH to ground switch-on RRTH resistance RTH output voltage RTH pull-down current
VBAT stand-by or sleep operation mode Io = 10 mA; normal
operating mode
- - -
43 0.7 75
95 1.0 -
V A
VoRTH IRTHpd
Io = 1 mA;
low power mode normal operating mode, failure cases 6 and 6a normal operating mode, failure cases 3, 3a, 5 and 7
RTL pull-up current
IRTLpu
-
- 75
-
A
RTH leakage current
IRTHl
-
0
5
A
VCC = 0 V, Vbat = 0 V, VCANH = 5 V, RRTH = 100 , Tj < 85 C
Semiconductor Group
18
1998-11-01
TLE 6252 G
Static Characteristics (cont'd) 4.75 V VCC 5.25 V; VNSTB = VCC; 6 V VBAT 27 V; - 40 Tj + 125 C (unless otherwise specified). All voltages are defined with respect to ground. Positive current flowing into the IC. Parameter RTL leakage current Symbol min. Limit Values typ. 0 max. 5 A - Unit Notes
IRTLl
VCC = 0 V, Vbat = 0 V, VCANL = 13.5 V, RRTL = 100 , Tj < 85 C
Thermal Shutdown Shutdown junction temperature
TjSH
150
-
-
o
C
-
Semiconductor Group
19
1998-11-01
TLE 6252 G
Dynamic Characteristics
VCC = 4.75 V to 5.25 V; VNSTB = VCC; VBAT = 6 V to 27 V; TA = - 40 to + 125 oC (unless
otherwise specified). All voltages are defined with respect to ground. Positive current flows into the IC.
Parameter CANH and CANL bus output transition time recessive-to-dominant CANH and CANL bus output transition time dominant-to-recessive Minimum dominant time for wake-up on CANL or CANH Symbol Limit Values min. typ. 1.4 max. 2.0 s 10% to 90%; C1 = 10 nF; C2 = 0; R1 = 100 10% to 90%; C1 = 1 nF; C2 = 0; R1 = 100 stand-by modes VBAT = 12 V Low power modes VBAT = 12 V normal operating mode normal operating mode normal operating mode normal operating mode normal operating mode stand-by modes; 0.6 Unit Notes
trd
tdr
0.7
1.0
1.3
s
twu(min)
8
22
38
s
Minimum WAKE Low time tWK(min) for wake-up Failure cases 3 and 6 detection time Failure case 6a detection time Failure cases 5, 6, 6a and 7 recovery time Failure cases 3 recovery time Failure cases 5 and 7 detection time Failure cases 5, 6, 6a and 7 detection time Failure cases 5, 6, 6a and 7 recovery time
20 30 2 30 150 0.75 0.8 -
36 55 4.8 55 450 1.8 3.6 2
60 80 8 80 750 4.0 8.0 -
s s ms s s ms ms s
tfail
VBAT = 12 V
stand-by modes; VBAT = 12 V
Semiconductor Group
20
1998-11-01
TLE 6252 G
Dynamic Characteristics (cont'd)
VCC = 4.75 V to 5.25 V; VNSTB = VCC; VBAT = 6 V to 27 V; TA = - 40 to + 125 oC (unless
otherwise specified). All voltages are defined with respect to ground. Positive current flows into the IC.
Parameter Propagation delay TxD-to-RxD LOW (recessive to dominant) Symbol Limit Values min. typ. 0.8 max. 1.5 s - Unit Notes
tPD(L)
C1 = 100 pF; C2 = 0; R1 = 100 ;
no failures and bus failure cases 1, 2, 3a and 4
-
0.8
1.5
s
C1 = C2 = 3.3 nF; R1 = 100 ; no bus
failure and failure cases 1, 2, 3a and 4
-
1.2
1.8
s
C1 100 pF; C2 = 0; R1 = 100 ; bus
failure cases 3, 5, 6, 6a and 7
-
1.2
1.8
s
C1 = C2 = 3.3 nF; R1 =100 ; bus
failure cases 3, 5, 6, 6a and 7
Semiconductor Group
21
1998-11-01
TLE 6252 G
Dynamic Characteristics (cont'd)
VCC = 4.75 V to 5.25 V; VNSTB = VCC; VBAT = 6 V to 27 V; TA = - 40 to + 125 oC (unless
otherwise specified). All voltages are defined with respect to ground. Positive current flows into the IC.
Parameter Propagation delay TxD-to-RxD HIGH (dominanat to recessive) Symbol Limit Values min. typ. 1.5 max. 2.0 s - Unit Notes
tPD(H)
C1 = 100 pF; C2 = 0; R1 =100 ;
no failures and bus failure cases 1, 2, 3a and 4
-
2.5
3.0
s
C1 = C2 = 3.3 nF; R1 = 100 ; no bus
failure and failure cases 1, 2, 3a and 4
-
1.0
1.5
s
C1 100 pF; C2 = 0; R1 = 100 ; bus
failure cases 3, 5, 6, 6a and 7
-
1.4
2.1
s
C1 = C2 = 3.3 nF; R1 = 100 ; bus
failure cases 3, 5, 6, 6a and 7
Minimum hold time to go sleep command
th(min)
4 -
22 4
38 -
s -
- normal operating mode
Edge-count difference ne (falling edge) between CANH and CANL for failure cases 1, 2, 3a and 4 detection NERR becomes LOW Edge-count difference (rising edge) between CANH and CANL for failure cases 1, 2, 3a and 4 recovery TxD permanent dominant disable time
Semiconductor Group
-
2
-
-
tTxD
1
2.5
4
ms
normal mode
22
1998-11-01
TLE 6252 G
Test and Application
+5V 7 6 5 4 3 2 TxD 1 INH 20 pF
WAKE ENT NSTB NERR RxD
TLE 6252
RTH RTL 8 9 CAN Transceiver V CC CANH CANL GND V BAT 10 11 12 13 14 + 12 V
R1
R1
C1
C2
C1 R 1 = 100 C 1,2 = 10 nF C K = 1 nF
CAN Bus Substitute 1
R1 CK
Schaffner Generator
R1 CK
CAN Bus Substitute 2
AES02423
Figure 5
Test Circuits
For isolated testing the CAN Bus Substitute 1 is connected to the CAN Transceiver (see Figure 5). The capacitors C1-3 simulate the cable. Allowed minimum values of the termination resistors RRTH and RRTL are 500 . Electromagnetic interference on the bus lines is simulated by switching to CAN Bus Substitute 2. The waves of the applied transients will be in accordance with ISO 7637 part 1, test 1, test pulses 1, 2, 3a and 3b.
Semiconductor Group
23
1998-11-01
TLE 6252 G
V BAT
C 505C / C 515C / C 164CJ Microcontroller with On - Chip CAN Module
+5 V
TLE 4271 / TLE 4276
Low Drop Voltage Regulator 22 F
7
6
5
4
3
2 TxD
1 INH
WAKE ENT NSTB NERR RxD
TLE 6252
CAN Transceiver
RTH 8
RTL 9
V CC CANH CANL GND
10 11 12 13
V BAT
14
R RTL R RTH
100 nF CAN Bus Line
100 nF
AES02422
Figure 6
Application of the TLE 6252 G
Semiconductor Group
24
1998-11-01
TLE 6252 G
Package Outlines P-DSO-14-2 (Plastic Dual Small Outline)
0.35 x 45
1.75 max 1.45 -0.2
0.19 +0.06
0.2 -0.1
4 -0.2 1)
1.27 0.35 +0.15 2) 14 0.1 0.2 14x 6 0.2 8 0.4 +0.8
1 7 8.75 -0.21) Index Marking 1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Does not include dambar protrusion of 0.05 max. per side
GPS05093
Sorts of Packing Package outlines for tubes, trays etc. are contained in our Data Book "Package Information". SMD = Surface Mounted Device Semiconductor Group 25
8 max.
Dimensions in mm 1998-11-01


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